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Nano Dimension Acquires Additive Flow Technology

Looks to drive software excellence in 3D design simulation and optimization.

Nano Dimension Ltd. announced today that it is acquiring the technology and intellectual property of the U.K.-based company Additive Flow, which supplies solutions for 3D design simulation and optimization.

Additive Flow has developed high-performance and high-quality simulation software for mechanical, thermal, thermo-mechanical properties, along with frequency and fatigue across a range of materials and processes. Their product addresses design, production, and quality decisions, while optimizing for cost, weight, manufacturing productivity, and manufacturing yield – all simultaneously.

The customer base of Additive Flow is from the following vertical market segments:
• Advance Optics & Optoelectronics
• Aerospace & Defense
• Semiconductors
• Advanced Energy
• Electronics

This acquisition signals a successful milestone in Nano Dimension’s product development roadmap. Computer-aided engineering and design components are a core part of the company’s design-through-manufacturing product strategy. Simulation algorithms and optimization capabilities are particularly crucial for leveraging the advantages of additive manufacturing.

Additive Flow’s AI and GPU (Graphics Processing Unit) accelerated software will enhance the ability of Nano Dimension customers to replicate, design, and augment AME electronic components’ prototypical layouts, in a rapid and cost-effective manner. Additive Flow’s core technology will be integrated into Nano Dimension’s proprietary design package suite, FLIGHT.

“We have been looking at the software market for simulation and optimization offerings for some time,” Nick Geddes, senior CTO of Nano Dimension, said. “There are many strong solutions in the market that do certain elements of those complicated tasks, but it is Additive Flow’s product that stood out in terms of the functionality we needed for a holistic solution, especially in the context of our requirements across AME and multi-dimensional polymer, metal and ceramic AM.”

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